J. E. · J. Ernst · L. E. · L.J.
| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| 2008 International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems | 978-1-4244-2127-5 (1-4244-2127-6) | 2008 | Institute of Electrical and Electronics Engineers |
| Benefiting from Thermal and Mechanical Simulation in Micro-Electronics | 978-0-7923-7278-3 (0-7923-7278-6) | 2000 | G.Q. Zhang · O. de Saint Leger |