| title | ISBN-13 | year of publica- tion | other author(s) |
|---|---|---|---|
| Advanced Interconnects and Contacts: Volume 564 | 978-1-55899-471-3 | 1999 | Daniel C. Edelstein · Takamaro Kikkawa · Mehmet C. Öztürk · Elizabeth J. Weitzman |
| Electronic Thin-Film Reliability | 978-0-521-51613-6 | 2010 | |
| Kinetics in Nanoscale Materials | 978-0-470-88140-8 | 2014 | Andriy M. Gusak |
| Silicon and Silicide Nanowires: Applications, Fabrication, and Properties | 978-981-4303-46-0 | 2013 | Yu Huang |
| Solder Joint Technology | 978-0-387-51583-0 | 2008 | |
| Solder Joint Technology: Materials, Properties, and Reliability | 978-0-387-38890-8 | 2007 | |
Cambridge University Press · Jenny Stanford Publishing · Springer · Wiley