McGraw-Hill · Van Nostrand Reinhold
| title | ISBN-13 | year of publication |
|---|---|---|
| Area Array Package Design | 978-0-07-173773-9 | 2003 |
| Area Array Package Design: Techniques in High Density Electronics | 978-0-07-142827-9 | 2003 |
| Area Array Packaging Handbook: Manufacturing and Assembly | 978-0-07-137493-4 | 2001 |
| Area Array Packaging Materials | 978-0-07-173800-2 | 2003 |
| Area Array Packaging Materials: Adhesives, Pastes, and Lead-Free | 978-0-07-142828-6 | 2003 |
| Area Array Packaging Processes | 978-0-07-173801-9 | 2003 |
| Area Array Packaging Processes: for BGA, Flip Chip, and CSP | 978-0-07-142829-3 | 2003 |
| Handbook of Flexible Circuits | 978-0-442-00168-1 | 1998 |
| MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes | 978-0-07-145556-5 | 2005 |
| Polymer Thick Film: Today's emerging technology for a clean environment tomorrow | 978-0-442-01220-5 | 1995 |
Kamni Gill · Ken Gale · Ken Gill · Ken Gilleo Ph.D. · Kenny Gallo