| title | media type | ISBN-13 | year of publica- tion | other author(s) | |
|---|---|---|---|---|---|
| Copper Electrodeposition for Nanofabrication of Electronics Devices | Paperback | 978-1-4939-5373-8 | 2016 | Rohan N. Akolkar · Dale P. Barkey · Masayuki Yokoi | |
| Copper Electrodeposition for Nanofabrication of Electronics Devices | Hardcover | 978-1-4614-9175-0 | 2013 | Rohan N. Akolkar · Dale P. Barkey · Masayuki Yokoi | |
| Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications | Taschenbuch | 978-3-319-79255-2 | 2019 | Morihiro Kada · Kenji Takahashi | |
| Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications | Gebunden | 978-3-319-18674-0 | 2015 | Morihiro Kada · Kenji Takahashi |