Jörg Frank

titleISBN-13
(ISBN-10)
year of publication
3D-MID: Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers978-1-5699O-551-7
(1-5699O-551-7)
2014

J. F. · J. Frank · Jörg & Rolf Frank

Jörg Franke