| Titel | ISBN-13 (ISBN-10) | Erschei- nungsjahr | andere Autoren |
|---|---|---|---|
| Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication:: From Particle Scale to Feature, Die and Wafer Scales | 978-3-642-06115-8 (3-642-06115-X) | 2010 | |
| Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales | 978-3-540-22369-6 (3-540-22369-X) | 2004 | David A. Dornfeld |
J. L. · Jianbang Liu · Jianbin Luo · Jianfeng Lu · Jianping Li · Jianping Liu · Jinfeng Liao · Jinfeng Liu · Junfang Li