| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Encyclopedia of Packaging Materials, Processes, and Mechanics: Die-attach and Wafer Bonding Technology | 978-981-12-O111-O (981-12-O111-O) | 2019 | Avram Bar-Cohen · Andrew Tay |
C.S. · J C · J. C. Suhling · J. S. · Jeffrey S.