IEEE Components Packaging & Manufacturin

titlemedia typeISBN-13year of publica-
tion
other author(s)
1995 Japan Iemt Symposium: Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium: December 4-6, 1995 Omiya, JapanPaperback978-0-7803-3622-31996
Eleventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium   "978-0-7803-2434-31995
IEEE 50th Electronic Components and Technology Conference 2000   "978-0-7803-5908-62001
IEEE 50th Electronic Components and Technology Conference 2000Hardcover978-0-7803-5909-32000
IEEE 50th Electronic Components and Technology Conference 2000   "978-0-7803-5911-62000
Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management SymposiumPaperback978-0-7803-5916-12000
Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management SymposiumHardcover978-0-7803-5917-82000IEEE
Thirteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium: Proceedings 1997 Austin, Tx, Usa, January 28-30, 1997Paperback978-0-7803-3793-01997   "

C.A. · C.P. · C.P.A. · I.A. · I.C. · I. P. · IEEE Components · P. A.

IEEE Computer Soc