| title | media type | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|---|
| Materials Reliability Issues in Microelectronics: Volume 225 | Paperback | 978-1-107-40987-3 (1-107-40987-X) | 2014 | James R. Lloyd · Paul S. Ho |
| The Mechanics of Solder Alloy Wetting and Spreading | " | 978-1-4684-1441-7 (1-4684-1441-0) | 2012 | Michael Hosking |
| The Mechanics of Solder Alloy Wetting and Spreading | Hardcover | 978-0-442-01752-1 (0-442-01752-9) | 1993 | " |
Cambridge University Press · Springer · Van Nostrand Reinhold