| title | ISBN-13 | year of publica- tion | other author(s) | |
|---|---|---|---|---|
| Advanced Interconnects for ULSI Technology | 978-0-470-66254-0 | 2012 | Mikhail Baklanov · Paul S. Ho | |
| Advanced Interconnects for Ulsi Technology | 978-1-119-96367-7 | 2012 | Mikhail Baklanov · Paul S. Ho | |
| Materials for Information Technology: Devices, Interconnects and Packaging | 978-1-85233-941-8 | 2005 | Caroline Whelan · Thomas Mikolajick | |
| Stress-Induced Phenomena in Metallization: Ninth International Workshop on Stress-Induced Phenomena in Metallization | 978-0-7354-0459-5 | 2007 | Shinichi Ogawa · Paul S. Ho | |
| Stress-Induced Phenomena in Metallization: Tenth International Workshop on Stress-Induced Phenomena in Metallization | 978-0-7354-0680-3 | 2009 | Paul S. Ho · Shinichi Ogawa | |
| Werkstoffe im Trend | 978-3-341-01173-7 | 1996 | ||
American Institute of Physics · Springer · Verlag Technik · Wiley