| title | media type | ISBN-13 | year of publica- tion | other author(s) |
|---|---|---|---|---|
| Advances in Electronic Packaging | Hardcover | 978-0-7918-1559-5 | 1997 | American Society of Mechanical Engineers · M. Shiratori · Y.C. Lee · et al |
| Moisture Sensitivity of Plastic Packages of IC Devices | Paperback | 978-1-4614-2625-7 | 2012 | X.J. Fan |
| Moisture Sensitivity of Plastic Packages of IC Devices | Hardcover | 978-1-4419-5718-4 | 2010 | " |
| Optical Interconnects: Materials, Performance and Applications: Volume 4138 | Paperback | 978-1-62748-242-4 | 2013 | |
| Structural Analysis in Microelectronic and Fiber O Ptic Systems | Hardcover | 978-0-471-59127-6 | 1921 | |
| Structural Analysis in Microelectronics and Fiber Optics | Paperback | 978-0-7918-1539-7 | 1996 | |
E. Saar · E. Sahouryeh · E. Sauer · E. Serra · E. Serri · E. Sohr · E. Sori · E Souriau · Ephraim Suhir · Ephram Suhir
ASME Press (American Society of Mechanical Engineers) · Curran Associates · Springer · Wiley