| Titel | Art | ISBN-13 (ISBN-10) | Erschei- nungsjahr | andere Autoren |
|---|---|---|---|---|
| 3D Microelectronic Packaging: From Fundamentals to Applications | Taschenbuch | 978-3-319-83086-5 (3-319-83086-4) | 2018 | Yan Li |
| 3D Microelectronic Packaging: From Fundamentals to Applications | Gebunden | 978-3-319-44584-7 (3-319-44584-7) | 2017 | " |
D G · DAVIES GILL · Davies Gilli · Davis Gayle · DAVIS GILL · Deepak Kumar Goyal · Dipak Gyawali