| title | ISBN-13 (ISBN-10) | year of publication |
|---|---|---|
| 2010 12th Electronics Packaging Technology Conference: Eptc 2010: Singapore, 8-10 December 2010 | 978-1-4244-8560-4 (1-4244-8560-6) | 2010 |
| Proceedings of 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis : June 27th-June 30 2006: Shan | 978-1-4244-0489-6 (1-4244-0489-4) | 2006 |
| Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems: Eurosime 2005 | 978-0-7803-9063-8 (0-7803-9063-6) | 2005 |
Austria) International Symposium on Water Chemistry and Corrosion Problems of Nuclear Reactor Systems and Components (1982 : Vienna · Calif.) Electronic Components & Technology (47th : 1997 : San Jose · California) Electronic Components & Technology Conference (52nd : 2002 : San Diego · Cambanis · Campan · Campana · Campanella · Campanile · Campanini · Campanitas · Campenon · Campeones · Campino · Campion · Campione · Campmany · Canovan · Chambon · Champaine · Champan · Champeny · Champion · CHAMPNEY · Champneys · Champonnois · Chumbawamba · Comibam · Compan · Companion · CompanionReads · Companitas · Company · Compendium · CompuMaster · Confiant · Confindustria · CONFINO · convener · Convention · Conventions · France) IFAC Symposium on Intelligent Components and Instruments for Control Applications (3rd : 1997 : Annecy · IEEE Components · IEEE Components Hybrids & Manufacturing · IEEE Components Packaging & Manufacturin · Packaging & Manufacturing Technology Society IEEE Components · Packaging & Manufacturing Technology Society. Singapore Chapter Components · Packaging, and Manufacturing Technology Society IEEE Components · Packaging IEEE Components · Wash.) Electronic Components & Technology Conference (48th : 1998 : Seattle