| title | ISBN-13 (ISBN-10) | year of publica- tion | other author(s) |
|---|---|---|---|
| Encyclopedia of Packaging Materials, Processes, and Mechanics: Die-attach and Wafer Bonding Technology | 978-981-12-O111-O (981-12-O111-O) | 2019 | Avram Bar-Cohen · Jeffrey C. Suhling |
Andras T. · Andreas Thie · Andrew A. Tay · Andrew T. · Andrew Teoh · Andrew Tu · Andrzej Te