|   | by: Ken Kuang · Franklin Kim · Sean S. CahillPaperback details (USA). details (United Kingdom). details (Germany). details (Canada). ISBN: 978-1-4899-8324-4 ISBN-10: 1-4899-8324-4 Springer · 2014 | 
| See also: | ||
| 2009 | Hardcover | RF and Microwave Microelectronics Packaging |