Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics)

by Xingcun Colin Tong

Hardcover

details (USA).
(see also: eBook (Kindle))

details (UK).
(see also: eBook (Kindle))

details (Germany).
(see also: Kindle Ausgabe)

details (Canada).
(see also: eBook (Kindle))

ISBN: 978-1-4419-7758-8

ISBN-10: 1-4419-7758-9

Springer · 2011