Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (The Springer International Series in Engineering and Computer Science)

Engineering

by: Erdogan Madenci · Ibrahim Guven · Bahattin Kilic

Hardcover

details (United States).

ISBN: 978-1-4020-7330-4

ISBN-10: 1-4020-7330-5

Springer · 2002