The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
by
Gerard Kelly
Hardcover
details (
USA
).
ISBN: 978-0-7923-8485-4
ISBN-10: 0-7923-8485-7
Springer
· 1999
See also:
2012
Paperback
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages