The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Encapsulated

by Gerard Kelly

Hardcover

ISBN: 978-0-7923-8485-4

ISBN-10: 0-7923-8485-7

Springer · 1999

See also:
2012PaperbackThe Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages