Printed Proceedings of the InterPACK 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (IPACK2018)

by ASME

Taschenbuch

details (UK).

ISBN: 978-0-7918-5192-0

ISBN-10: 0-7918-5192-3

American Society of Mechanical Engineers,U.S. · September 2019