Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

by: American Society of Mechanical Engineers. Electrical and Electronic Packaging Division · Ga.) International Mechanical Engineering Congress and Exposition (1996 : Atlanta · f Symposium on Mechanics of Smt and Photonic Structures 2000 Orlando

Paperback

ISBN: 978-0-7918-1930-2

ISBN-10: 0-7918-1930-2

Amer Society of Mechanical · 2000