1996 International Conference on Simulation of Semiconductor Processes and Devices Sispad '96: September 2-4, 1996, Toyo University, Hakusan Campus, Tokyo, Japan

International

by International Conference on Simulation of Semiconductor Processes and

Paperback

details (USA).

ISBN: 978-0-7803-2745-0

ISBN-10: 0-7803-2745-4

IEEE · 1996