Y. W. Mai

W. M. · Y. W. Mai A. G. Atkins · Yiu-Wing Mai

titlemedia typeISBN-13year of publica-
tion
other author(s)
Elastic and Plastic FracturePaperback978-0-13-248188-51988A.G. Atkins
Elastic and Plastic FractureHardcover978-0-13-248196-01988   "
Failure of Electronic Packaging: Effects of Tempature, Moisture, and Mechanical Driving Forces   "978-1-4398-2788-82010E. H. Wong · S. K. Woon
Failure of Electronic Packaging: Effects of Temperature, Moisture, Mechanical, and Electrical Driving Forces   "978-1-4398-0209-02010E. H. Wong
Fracture Mechanics of Cementitious MaterialsPaperback978-0-367-86607-52019B. Cotterell
Physical Properties and Applications of Polymer Nanocomposites   "978-0-08-101489-92016S C Tjong
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture: Effects of Temperature, Moisture, Mechanical and ... ... Series in Electronic and Optical Materials)Hardcover978-1-84569-528-62015E-H Wong
Science and Engineering of Short Fibre Reinforced Polymer Composites   "978-1-4398-1099-62009S. Y. Yu · B. Lauke

CRC Press · Pergamon Press · Prentice Hall · Routledge · Woodhead Publishing Ltd

 

Y. W. Mai A. G. Atkins