Y. C. Lee

C. L. · C. Lee · E.Y.C. Lee · Y. Lee · Young Chul Lee · Yu-cheng Lee · Yuk-Cheung Lee

Academic Press · American Society of Mechanical Engineers · John Wiley & Sons · Springer

titleISBN-13year of publica-
tion
other author(s)
Advances in Electronic Packaging978-0-7918-1559-51997American Society of Mechanical Engineers · E. Suhir · et al
Analytical Method Validation and Instrument Performance Verification978-0-471-25953-42004Chung Chow Chan · Herman Lam · XueMing Zhang
Manufacturing Challenges in Electronic Packaging978-0-412-62030-01997W.T. Chen
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume 1 Materials Physics / Materials Mechanics. ... Physical Design / Reliability and Packaging978-0-387-27974-92007Ephraim Suhir · C.P. Wong
Neoglycoconjugates, Part A, Synthesis, Volume 242978-0-12-182143-21994John N. Abelson · Melvin I. Simon · Reiko T. Lee
Neoglycoconjugates: Preparation and Applications978-0-12-440585-11994Reiko T. Lee
Recognition of Carbohydrates in Biological Systems, Part A: General Procedures, Volume 362978-0-12-182265-12003   "
Recognition of Carbohydrates in Biological Systems, Part B: Specific Applications, Volume 363978-0-12-182266-82003   "

 

Y.-C. Wong